Sidewall Modification of Porous SiOCH Induced by Etching and Post Etching Plasma Treatments

R. Bouyssou (1) , T. Chevolleau (2) , M. El Kodadi (2) , M. Besacier (2) , N. Possémé (3) , R. Hurand (2) , T. David (2, 3) , C. Licitra , Maxime Darnon (2) , C. Vérove , O. Joubert (2)

1 ST-CROLLES - STMicroelectronics [Crolles]
2 LTM - Laboratoire des technologies de la microélectronique
3 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information

R. Bouyssou, T. Chevolleau, M. El Kodadi, M. Besacier, N. Possémé, et al.. Sidewall Modification of Porous SiOCH Induced by Etching and Post Etching Plasma Treatments. 3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France. ⟨hal-00625382⟩