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hal-00625347v1  Conference papers
Nicolas PosséméThibaut DavidThierry ChevolleauMaxime DarnonPhilippe Brun et al.  Porous SiOCH integration: Etch challenges with a trench first metal hard mask approach
Chinese Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China. pp.389-394, ⟨10.1149/1.3567609⟩