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hal-00398866v1  Conference papers
Maxime DarnonT. ChevolleauT. DavidD. PerretJ. Torres et al.  Dielectric Trenches Patterning: Metallic Vs Organic Hard Mask
Proceeding of MAM, Metal Advanced Metallization (Workshop), 2007, bruges, Belgium
hal-00808668v1  Journal articles
S. BannaA. AgarwalT. LillG. CungeMaxime Darnon et al.  Critical Review: Pulsed High-Density Plasmas for Advanced Dry Etching Processes
Journal of Vacuum Science & Technology A, American Vacuum Society, 2012, pp.30, 040801. ⟨10.1116/1.4716176⟩
hal-00629230v1  Journal articles
C. Petit-EtienneMaxime DarnonL. VallierE. PargonG. Cunge et al.  Etching mechanisms of thin SiO2 exposed to Cl2 plasma
Journal of Vacuum Science and Technology, American Vacuum Society (AVS), 2011, B 29(5), Sep/Oct 2011
hal-00625345v1  Conference papers
O. JoubertMaxime DarnonG. CungeE. PargonL. Vallier et al.  Interest of synchronized pulsed plasmas for next CMOS technologies
China Semiconductor Technology International Conference (CSTIC) 2011, Mar 2011, Shanghaï, China
hal-00808682v1  Conference papers
O. JoubertMaxime DarnonG. CungeE. PargonT. David et al.  Towards new plasma technologies for 22 nm gate etch processes and beyond
SPIE Advanced Lithography, 2012, San Jose, United States. pp.83280D, ⟨10.1117/12.920312⟩
hal-00860922v1  Conference papers
Maxime DarnonG. CungeC. Petit EtienneE. PargonL. Vallier et al.  Pulsed plasmas for etching at the nanoscale
Journées Nationales des Technologies Émergentes, May 2013, Evian les bains, France
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hal-00387506v1  Journal articles
Maxime DarnonT. ChevolleauD. EonR. BouyssouB. Pelissier et al.  Patterning of narrow porous SiOCH trenches using a TiN hard mask
Microelectronic Engineering, Elsevier, 2008, 85 (11), pp.2226-2235. ⟨10.1016/j.mee.2008.06.025⟩
hal-00904428v1  Conference papers
E. Despiau-PujoM. BrihoumG. CungeMaxime DarnonN. Braithwaite et al.  Pulsed plasma processing: A combined modelling and experimental study
31st International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2013, Granada, Spain
hal-00399993v1  Conference papers
T. ChevolleauMaxime DarnonT. DavidD. PerretJ. Torres et al.  Metallic versus Organic Hard Mask Strategies for Advanced Dielectric Trenches Patterning
Proceeding of DPS, Symposium on Dry Process, 2007, tokyo, Japan
hal-00625347v1  Conference papers
Nicolas PosséméThibaut DavidThierry ChevolleauMaxime DarnonPhilippe Brun et al.  Porous SiOCH integration: Etch challenges with a trench first metal hard mask approach
Chinese Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China. pp.389-394, ⟨10.1149/1.3567609⟩
hal-00625350v1  Conference papers
T. LillO. JoubertMaxime DarnonS. BannaA. Agarwal. Angstrom Level Resolution Etch
China Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China
hal-00625357v1  Conference papers
N. PossemeT. DavidT. ChevolleauMaxime DarnonF. Bailly et al.  Porous SiCOH Patterning for Advanced Interconnects: Challenges and Solutions
Electrochem. 219th Soc. Meeting, 2011, Montreal, Canada
hal-00860934v1  Conference papers
E. Despiau-PujoM. BrihoumG. CungeMaxime DarnonN.S. Braithwaite et al.  Pulsed ICP chlorine plasmas : Numerical simulations versus Experiments
4th Workshop on Radio Frequency Discharges, May 2013, giens, France
hal-00860915v1  Journal articles
M. BrihoumG. CungeMaxime DarnonD. GahanO. Joubert et al.  Ion flux and ion distribution function measurements in synchronously pulsed inductively coupled plasmas
Journal of Vacuum Science and Technology, American Vacuum Society (AVS), 2013, A 31(2), pp.020604. ⟨10.1116/1.4790364⟩
hal-00400476v1  Conference papers
T. ChevolleauG. CungeMaxime DarnonR. RamosL. Vallier et al.  Emerging Application of Fluorocarbon Plasmas for Integrated Circuits Fabrication
8th International workshop on fluorocarbon plasma, 2006, autrans, France
hal-00625382v1  Conference papers
R. BouyssouT. ChevolleauM. El KodadiM. BesacierN. Possémé et al.  Sidewall Modification of Porous SiOCH Induced by Etching and Post Etching Plasma Treatments
3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France
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hal-00625314v1  Conference papers
T. ChevolleauN. PossemeT. DavidR. BouyssouJ. Ducote et al.  Etching Process Scalability and Challenges for ULK Materials
International Interconnect Technology Conference, IITC, Jun 2010, Dresde, Germany. ⟨10.1109/IITC.2010.5510735⟩
hal-00400477v1  Conference papers
T. ChevolleauD. EonMaxime DarnonT. DavidL. Vallier et al.  Patterning of narrow SiOCH trenches using the late porogen removal process
AVS, 53rd International AVS Symposium, 2006, san francisco, United States