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hal-00623448v1  Journal articles
N. ZeggaouiV. FarysY. TrouillerE. YesiladaF. Robert et al.  Optimization of double patterning split by analyzing diffractive orders in the pupil plane
Photomask Technology 2010 Proceedings, 2010, Vol. 7823, 24 September 2010
hal-00494552v1  Journal articles
O. ToublanP. SchiavoneR. GwozieckiD. Boutin. Statistical analysis of CD variation across the lens field
Microlithography World, Pennwell Publishing Company, 2000, vol.9, n°2, Spring
hal-00625298v1  Journal articles
S. DemuynckH. KimC. HuffmanMaxime DarnonH. .Struyf et al.  Dielectric Reliability of 50nm Half Pitch Structures in Aurora® LK
Japanese Journal of Applied Physics, Japan Society of Applied Physics, 2009, 48, April 2009, 04C018
hal-00670223v1  Journal articles
L. ShenJ. FuK. FuC. PicartJ. Ji. Humidity Responsive Asymmetric Free-Standing Multilayered Film
Langmuir, American Chemical Society, 2010, pp.26 (22) 16634-16637. ⟨10.1021/la102928g⟩
hal-00994309v1  Journal articles
Yong XuW. ScheidelerChuan LiuF. BalestraK. Tsukagoshi. Contact thickness effects in bottom-contact coplanar organic field-effect transistors
IEEE Electron Device Letters, Institute of Electrical and Electronics Engineers, 2013, 34 (4), pp.535-7. ⟨10.1109/LED.2013.2244059⟩
hal-00996640v1  Journal articles
F. RouxS. AmtablianM. AntonG. BesnardL. Bilhaut et al.  Chalcopyrite thin-film solar cells by industry-compatible ink-based process
Solar Energy Materials and Solar Cells, Elsevier, 2013, 115, pp.86-92. ⟨10.1016/j.solmat.2013.03.029⟩
hal-00778010v1  Journal articles
J.H. ChoiL. Latu-RomainEdwige BanoA. HenryW.J. Lee et al.  Comparative study on dry etching of α- and β-SiC nano-pillars
Materials Letters, Elsevier, 2012, pp.87 (2012) 9-12
hal-00397572v1  Journal articles
D. KaddourH. IssaM. AbdelazizFlorence PodevinEmmanuel Pistono et al.  Design Guidelines for Low-Loss Slow-Wave Coplanar Transmission Lines In RF-CMOS Technology
Microwave and Optical Technology Letters, Wiley, 2008, 50 (12), pp.3029 ¬ 3036
hal-00397110v1  Journal articles
T. LillO. R. Joubert. Materials science- The cutting edge of plasma etching
Science, American Association for the Advancement of Science (AAAS), 2008, pp.319, 1050-1051, (2008)
hal-00397051v1  Journal articles
J. ThiaultJ. FoucherJ.H. TortaiO. JoubertS. Landis et al.  Line edge roughness characterization with a three dimensional atomic force microscope: Transfer during gate patterning processes
Journal of Vacuum Science and Technology, American Vacuum Society (AVS), 2005, pp.B 23 3075-3079
hal-00397053v1  Journal articles
N. PossemeT. DavidP. MeiningerO. LouveauT. Chevolleau et al.  Impact of downstream ash plasmas on ultra low-k materials
Solid State Phenomena, Trans Tech Publications Ltd 2005, pp.103-104 (2005), 337-340
hal-00397072v1  Journal articles
R. RamosG. CungeO. R. Joubert. On the interest of carbon-coated plasma reactor for advanced gate stack etching processes
J. Vac. Sci. Technol. A 25, (2007), 290-303, 2007, pp.J. Vac. Sci. Technol. A 25, (2007), 290-303
hal-00397097v1  Journal articles
T. MorelS. BarnolaR. RamosA. BeaurainE. Pargon et al.  Tungsten metal gate etching in Cl2/O2 inductively coupled high density plasmas
J. Vac. Sci. Technol, 2008, pp.B 26, (2008), 1875-1882
hal-00394502v1  Journal articles
N. KehagiasV. ReboudM. ZelsmannM. StriccoliM. Tamborra et al.  Modification of spontaneous emission of (CdSe)ZnS nanocrystals embedded in nanoimprinted photonic crystals
Journal of Nanoscience and Nanotechnology, American Scientific Publishers, 2008, pp.8, 2 (2008) 535-539