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Caractérisation et analyse du couplage substrat entre le TSV et les transistors MOS dans les circuits intégrés 3D.

Abstract : To improve performances of integrated circuits and decrease the technology cost, designers follow “Moore's law” and “Moore than Moore law”, respectively consisting in increasing the transistor density and integrating heterogeneous circuits. This two challenges to overcome leads to a new one: the improvement of the interconnect density. In 2D circuits, the pitch of the pads is still inaccurate compared to the strong component density. Wire bonding and bumps connecting the different chips (Processor, Memory, Logic…) are long and big, leading to RC delays, losses and electrical coupling. 3D integration is a promising strategy consisting in optimizing interconnects by processing TSVs, short and high-density-allowed connections crossing the silicon bulk involving an electrically efficient way to connect the chips. To achieve high performance and reliability in 3D IC, new design rules have to be investigated because of the specific electrical, mechanical and thermal constraints for 3D stacks. Works presented focus on the high frequency substrate noise generated by high speed signals transmitted along TSVs and its impact on sensitive circuits, such as Low Noise Amplifiers. This phenomenon is a major concern for 3D circuit design and yet still lack of extraction results due to experimental difficulties in extracting noise values in a complex 3D stack. The aim of the thesis was to characterize the coupling noise between TSV and MOS devices to understand involved phenomena and to propose solutions. To raise these objectives, we studied isolated TSV, coupled TSV, TSV to wells and MOS transistor coupling through multi-physics simulations, modeling, and measurement up to 40GHz according to polarization and frequency. Specific 3D radiofrequency test structures in 4 ports have been designed for experimental characterization.
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Submitted on : Friday, February 28, 2014 - 4:23:19 PM
Last modification on : Friday, March 25, 2022 - 9:40:23 AM
Long-term archiving on: : Wednesday, May 28, 2014 - 7:50:12 PM


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  • HAL Id : tel-00954178, version 1



Mélanie Brocard. Caractérisation et analyse du couplage substrat entre le TSV et les transistors MOS dans les circuits intégrés 3D.. Autre. Université de Grenoble, 2013. Français. ⟨NNT : 2013GRENT049⟩. ⟨tel-00954178⟩



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