Using Laminated Metal Foam as the Top-Side Contact of a PCB-Embedded Power Die

Yoann Pascal (1, 2) , Abdedaim Amar (3) , Denis Labrousse (1, 2) , Mickaël Petit (1, 2) , Stéphane Lefebvre (1, 2) , Francois Costa (4, 2)

1 CNAM - Conservatoire National des Arts et Métiers [CNAM]
2 SATIE - Systèmes et Applications des Technologies de l'Information et de l'Energie
3 ENS Cachan - École normale supérieure - Cachan
4 UPEC UP12 - Université Paris-Est Créteil Val-de-Marne - Paris 12

The proposed innovative manufacturing process— described in detail—uses metal foam to create a pressed contact between the top side of a PCB-embedded power die and the rest of the circuit. Initial prototypes were constructed using diodes with die dimensions of 4 mm × 6.35 mm. The prototypes were electrically characterized: the chip and contact DC and AC impedance values were measured and compared with those obtained for conventional packaging that uses bond wires. The electrical impedance of the prototypes was found to be similar to that of a state-of-the-art industrial package. Moreover, the proposed process is simple and cost-effective. Although the results presented in this letter are promising, further research is necessary to fully assess the benefits and limitations of the process.

Mots clés: Embedded die; high-density integration; converter; PCB embedding; PCB integration; power electronics; packaging; pressed contact

Domaines: Energie électrique; Electronique

Yoann Pascal, Abdedaim Amar, Denis Labrousse, Mickaël Petit, Stéphane Lefebvre, et al.. Using Laminated Metal Foam as the Top-Side Contact of a PCB-Embedded Power Die. IEEE Electron Device Letters, 2017, ⟨10.1109/LED.2017.2748223⟩. ⟨hal-01582268⟩