E. Bettendorf, C. Malenfant, and C. Chabannon, RFID Technology and Electronic Tags to Identify Cryopreserved Materials, Cell Preservation Technology, vol.3, issue.2, pp.112-115, 2005.
DOI : 10.1089/cpt.2005.3.112

F. Ihmig, S. Shirley, C. Durst, and H. Zimmermann, Winter Simulation Conference Cryogenic electronic memory infrastructure for physically related "continuity of care records" of frozen cells, Cryogenics, vol.464, issue.4, pp.2065-2077312, 2006.

H. Hsu, S. Yu, Y. Hsu, W. Chang, M. Lin et al., Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package, 2006 7th International Conference on Electronic Packaging Technology, pp.1-6, 2006.
DOI : 10.1109/ICEPT.2006.359731

M. Su, X. Boddaert, K. Inal, W. Ren, and J. Wang, Numerical Investigations of Smart Card Module: Parametric Analysis and Design Optimization Device and Materials Reliability Shell-based simplified electronic package model development and its application for reliability analysis, IEEE Transactions on. Electronics Packaging Technology, vol.87, issue.3, pp.464-470, 2003.

C. Mao and R. Chen, Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint. Microelectronics Reliability, 2008.

W. Zhu, S. Stoeckl, H. Pape, S. Gan, W. Loh et al., Comparative study on solder joint reliability using different FE-models, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), pp.119-131, 2003.
DOI : 10.1109/EPTC.2003.1271607

V. Bechel, M. Fredin, S. Donaldson, R. Kim, and J. Camping, Effect of stacking sequence on micro-cracking in a cryogenically cycled carbon/bismaleimide composite, Composites Part A: Applied Science and Manufacturing, vol.34, issue.7, pp.171-182, 2003.
DOI : 10.1016/S1359-835X(03)00054-X

R. Patterson, A. Hammoud, M. Elbuluk, D. Liu, Y. Chao et al., Assessment of electronics for cryogenic space exploration missions Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method. Finite Elements in Analysis and Design [16] Schafft HA. Failure analysis of wire bonds. In: Annual Symposium of Reliability physics, Electronic packaging materials for extreme IEEE Transactions on Advanced Packaging LJ. On Wire Failures in Microelectronic Packages. In: International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, pp.408-420231, 1973.

C. Wang and R. Sun, The Quality Test of Wire Bonding, Modern Applied Science, vol.3, issue.12, pp.50-56, 2009.
DOI : 10.5539/mas.v3n12p50