Electrical and tribological properties of tin plated copper alloy for electrical contact in relation to intermetallic growth

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Conference papers
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https://hal-supelec.archives-ouvertes.fr/hal-00320307
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Submitted on : Wednesday, September 10, 2008 - 4:36:00 PM
Last modification on : Thursday, November 22, 2018 - 2:26:50 PM

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  • HAL Id : hal-00320307, version 1

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Sophie Noël, Nicole Lécaudé, Sandra Correia, P. Gendre, A. Grosjean. Electrical and tribological properties of tin plated copper alloy for electrical contact in relation to intermetallic growth. 52nd IEEE Holm Conference, 2006, Canada. ⟨hal-00320307⟩

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