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Electrical and tribological properties of tin plated copper alloy for electrical contact in relation to intermetallic growth

Sophie Noël 1 Nicole Lécaudé 1 Sandra Correia 1 P. Gendre A. Grosjean
1 LGEP - Laboratoire de génie électrique de Paris
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Conference papers
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https://hal-supelec.archives-ouvertes.fr/hal-00320307
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Submitted on : Wednesday, September 10, 2008 - 4:36:00 PM
Last modification on : Thursday, June 17, 2021 - 3:49:45 AM

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  • HAL Id : hal-00320307, version 1

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CNRS | SUPELEC | UPMC | SUP_LGEP | SORBONNE-UNIVERSITE | EC-PARIS

Citation

Sophie Noël, Nicole Lécaudé, Sandra Correia, P. Gendre, A. Grosjean. Electrical and tribological properties of tin plated copper alloy for electrical contact in relation to intermetallic growth. 52nd IEEE Holm Conference, 2006, Canada. ⟨hal-00320307⟩

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