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ECOLE SUPÉRIEURE D'ÉLECTRICITÉ Une grande école d'ingénieurs au cœur des sciences de l'information,de l'énergie et des systèmes |
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Conference papers
Temperature-Power Consumption Relationship and Hot-spot Migration for FPGA-based System
Abstract : Heat emission and temperature control in an electronic device is known to be highly correlated to power consumption as well as to equipment's reliability. Within this context, this paper discusses a possible solution to restrict processing component's heat emission in FPGA-based system (e.g., Cognitive Radio (CR) equipment). It also describes the implementation, on reconfigurable FPGA based circuit, of a digital thermal sensor, analyzes the applicability of local heat estimations, and empirically describes the temperature-power consumption relationship in a dynamically reconfigurable FPGA platform. Finally, discussions are conducted on the decision making issues related to the use of such sensors to enable "hot-spot" migration in CR equipment.
https://hal-supelec.archives-ouvertes.fr/hal-00552125
Contributor : Myriam Andrieux Connect in order to contact the contributor
Submitted on : Wednesday, January 5, 2011 - 3:12:52 PM
Last modification on : Friday, October 22, 2021 - 3:03:22 AM
Contributor : Myriam Andrieux Connect in order to contact the contributor
Submitted on : Wednesday, January 5, 2011 - 3:12:52 PM
Last modification on : Friday, October 22, 2021 - 3:03:22 AM