HAL will be down for maintenance from Friday, June 10 at 4pm through Monday, June 13 at 9am. More information
Skip to Main content Skip to Navigation
Conference papers

Temperature-Power Consumption Relationship and Hot-spot Migration for FPGA-based System

Abstract : Heat emission and temperature control in an electronic device is known to be highly correlated to power consumption as well as to equipment's reliability. Within this context, this paper discusses a possible solution to restrict processing component's heat emission in FPGA-based system (e.g., Cognitive Radio (CR) equipment). It also describes the implementation, on reconfigurable FPGA based circuit, of a digital thermal sensor, analyzes the applicability of local heat estimations, and empirically describes the temperature-power consumption relationship in a dynamically reconfigurable FPGA platform. Finally, discussions are conducted on the decision making issues related to the use of such sensors to enable "hot-spot" migration in CR equipment.
Document type :
Conference papers
Complete list of metadata

Contributor : Myriam Andrieux Connect in order to contact the contributor
Submitted on : Wednesday, January 5, 2011 - 3:12:52 PM
Last modification on : Wednesday, April 27, 2022 - 4:29:19 AM


  • HAL Id : hal-00552125, version 1


Xun Zhang, Wassim Jouini, Pierre Leray, Jacques Palicot. Temperature-Power Consumption Relationship and Hot-spot Migration for FPGA-based System. GreenCom2010, Dec 2010, Hangzhou, China. 6 p. ⟨hal-00552125⟩



Record views