Coil-to-sample distance influence on contactless QSSPC effective lifetime measurements : application to silicon wafers passivated by thin amorphous layers

Wilfried Favre; Laroussi Bettaieb; J. Després; José Alvarez; Jean-Paul Kleider; Yann Le Bihan; Zakaria Djebbour; Denis Mencaraglia

Coil-to-sample distance influence on contactless QSSPC effective lifetime measurements : application to silicon wafers passivated by thin amorphous layers

Wilfried Favre ¹ Laroussi Bettaieb ¹ J. Després José Alvarez ¹ Jean-Paul Kleider ¹ Yann Le Bihan ² Zakaria Djebbour ¹ Denis Mencaraglia ¹

1 SCM - Equipe Semiconducteurs en Couches Minces

LGEP - Laboratoire de génie électrique de Paris

2 COCODI - Equipe Conception, Commande et Diagnostic

LGEP - Laboratoire de génie électrique de Paris

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Conference papers

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https://hal-supelec.archives-ouvertes.fr/hal-00710780
Contributor : Olivier Schneegans <>
Submitted on : Thursday, June 21, 2012 - 3:53:51 PM
Last modification on : Wednesday, October 23, 2019 - 11:14:03 PM

Coil-to-sample distance influence on contactless QSSPC effective lifetime measurements : application to silicon wafers passivated by thin amorphous layers

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Coil-to-sample distance influence on contactless QSSPC effective lifetime measurements : application to silicon wafers passivated by thin amorphous layers

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