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Temperature-Power Consumption Relationship and Hot-Spot Migration for FPGA-Based Systems

Abstract : Heat emission and temperature control in an electronic device are highly correlated with power consumption as well as to equipment's reliability. Within this context, this chapter discusses a possible solution to restrict the processing component's heat emission in FPGA-based systems (e.g., Cognitive Radio [CR] equipment). It also describes the implementation, on reconfigurable FPGA based circuit, of a digital thermal sensor, analyzes the applicability of local heat estimations, and empirically describes the temperature-power consumption relationship in a dynamically reconfigurable FPGA platform. Finally, discussions are conducted on the decision making issues related to the use of such sensors to enable "hot-spot" migration in CR equipment.
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Contributor : Myriam Andrieux Connect in order to contact the contributor
Submitted on : Tuesday, September 25, 2012 - 11:36:36 AM
Last modification on : Wednesday, April 27, 2022 - 3:50:30 AM



Xun Zhang, Pierre Leray, Jacques Palicot. Temperature-Power Consumption Relationship and Hot-Spot Migration for FPGA-Based Systems. Naima Kaabouch and Wen-Chen Hu. Energy-Aware Systems and Networking for Sustainable Initiatives, IGI Global, pp.377-396, 2012, ⟨10.4018/978-1-4666-1842-8⟩. ⟨hal-00735057⟩



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