Temperature Measurement of Tungsten Electrode Surface at Electric Arc Extinction in Air-Power Flux Estimation

Romaric Landfried 1 Thierry Leblanc 1 Laurent Savi 1 Philippe Teste 1
1 LGEP - Laboratoire de génie électrique de Paris
Abstract : This paper deals with temperature measurements of the surface of tungsten electrodes submitted to electric arcs in nonstationary regimes in air at atmospheric pressure and with the estimation of the power and power density brought by electric arcs to the electrodes. Temperature measurements are proposed for tungsten anodes and cathodes for current intensity of ~30 A and duration of 3 ms. The temperature of the electrode surface at the instant the arc extinguishes is estimated in both electrode polarities. These experimental results are used in a model to estimate the power and the power density brought to the tungsten electrode surface by electric arcs. We found that the power surface density brought by electric arcs to the electrodes was in the range 1. × 109-1.5 × 109 W/m2 in the case of anodes and in the range 1.3×109-1.9×109 W/m2 in the case of cathodes. It has also been found that reactions of tungsten oxidation had to be considered to explain the high values obtained for the power brought to the electrodes.
Type de document :
Article dans une revue
IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), 2014, 4 (10), pp.1606 - 1612. 〈10.1109/tcpmt.2014.2343792〉
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https://hal-supelec.archives-ouvertes.fr/hal-01083426
Contributeur : Thierry Leblanc <>
Soumis le : lundi 17 novembre 2014 - 11:51:07
Dernière modification le : jeudi 22 novembre 2018 - 14:28:35

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Romaric Landfried, Thierry Leblanc, Laurent Savi, Philippe Teste. Temperature Measurement of Tungsten Electrode Surface at Electric Arc Extinction in Air-Power Flux Estimation. IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), 2014, 4 (10), pp.1606 - 1612. 〈10.1109/tcpmt.2014.2343792〉. 〈hal-01083426〉

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