G. E. Moore, ?Progress in digital integrated electronics?, Electron Devices Meeting, 197?, IEEE International, vol.21, pp.11-13, 1975.

C. G. Hwang, ?Nanotechnology enables a new memory growth model? [3] International Technology Roadmap for Semiconductors. Site: http://www.itrs.net/Links, Proceedings of the IEEE, pp.1765-1771, 2003.

Q. Liu, A. Yagishita, N. Loubet, A. Khakifirooz, and P. Kulkarnim, ?Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22 nm node and beyond?, ?LSI Technology, pp.61-62, 2010.

D. Hisamoto, T. Kaga, and E. Takeda, Impact of the vertical SOI 'DELTA' structure on planar device technology, IEEE Transactions on Electron Devices, vol.38, issue.6, pp.1419-1424, 1991.
DOI : 10.1109/16.81634

N. Lindert, L. Chang, Y. Choi, E. H. Anderson, and W. Lee, ?Sub ?0 nm quasi-planar FinFETs fabricated using a simplified process?, Electron Device Letters, pp.487-489, 2001.

A. Khakifirooz, K. Cheng, P. Kulkarni, J. Cai, and S. Ponoth, ?Challenges and opportunities of extremely thin SOI (ETSOI) CMOS technology for future low power and general purpose system-on-chip applications?, VLSI Technology Systems and Applications, International Symposium on, pp.110-111, 2010.

C. Fenouillet-beranger, S. Denorme, P. Perreau, C. Buj, and O. Faynot, FDSOI devices with thin BOX and ground plane integration for 32nm node and below, Solid-State Electronics, vol.53, issue.7, pp.730-734, 2009.
DOI : 10.1016/j.sse.2009.02.009

C. Auth, C. Allen, A. Blattner, D. Bergstrom, and M. Brazier, ?A 22 nm high performance and low-power CMOS technology featuring fully-depleted triple-gate transistors, self-aligned contacts and high density MIM capacitors?, ?LSI Technology, pp.131-132, 2012.

K. J. Kuhn, ?CMOS scaling for the 22 nm node and beyond: Device physics and technology?, VLSI Technology, Systems and Applications, International Symposium on, pp.1-2, 2011.

G. K. Celler and S. Cristoloveanu, Frontiers of silicon-on-insulator, Journal of Applied Physics, vol.93, issue.9, pp.4995-4978, 2003.
DOI : 10.1063/1.1558223

C. Fenouillet-beranger, S. Denorme, B. Icard, F. Beouf, and J. Coignus, ?Fully-depleted SOI technology using high-k and single-metal gate for 32 nm node LSTP applications featuring 0, 179 ?m 2 6T-SRAM bitcell?, Electron Devices Meeting, pp.267-270, 2007.

D. Munteanu, D. A. Weiser, S. Cristoloveanu, O. Faynot, and J. Pelloie, Generation-recombination transient effects in partially depleted SOI transistors: systematic experiments and simulations, IEEE Transactions on Electron Devices, vol.45, issue.8, pp.1678-1683, 1998.
DOI : 10.1109/16.704363

H. Lim and J. G. Fossum, ?Threshold voltage of thin-film silicon-on-insulator (SOI) MOSFET's?, Electron Devices, IEEE Transactions on, vol.30, issue.10, pp.1244-1251, 1983.

B. Mazhari, S. Cristoloveanu, D. E. Ioannou, and A. L. Caviglia, Properties of ultra-thin wafer-bonded silicon-on-insulator MOSFET's, IEEE Transactions on Electron Devices, vol.38, issue.6, pp.1289-1295, 1991.
DOI : 10.1109/16.81619

T. Ouisse, S. Cristoloveanu, and G. Borel, Influence of series resistances and interface coupling on the transconductance of fully-depleted silicon-on-insulator MOSFETs, Solid-State Electronics, vol.35, issue.2, pp.141-149, 1992.
DOI : 10.1016/0038-1101(92)90053-F

B. G. Streetman and S. Banerjee, Solid state electronics 6 th edition. Prentice Hall series in solid state physical electronics, 2006.

?. Muller and I. Eisele, Velocity saturation in short channel field effect transistors, Solid State Communications, vol.34, issue.6, pp.447-449, 1980.
DOI : 10.1016/0038-1098(80)90648-1

L. D. Yau, ?A simple theory to predict the threshold voltage of short-channel IGFET's?, Solid-State Electronics, pp.1059-1063, 1974.

J. E. Chung, M. Jeng, J. E. Moon, P. Ko, and C. Hu, Low-voltage hot-electron currents and degradation in deep-submicrometer MOSFETs, IEEE Transactions on Electron Devices, vol.37, issue.7, pp.1651-1657, 1990.
DOI : 10.1109/16.55752

K. Roy, S. Mukhopadhyay, and H. Mahmoodi-meimand, Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits, Proceedings of the IEEE, pp.305-327, 2003.
DOI : 10.1109/JPROC.2002.808156

N. Kotani and S. Kawazu, ?Computer analysis of punch-through in MOSFETs?, Solid-State Electroncis, pp.63-70, 1979.

R. J. Hueting and A. Heringa, ?Analysis of the subthreshold current of pocket or halo-implanted nMOSFETs?, Electron Devices, IEEE Transactions on, vol.3, issue.7, pp.1-41, 2006.

J. J. Barnes, K. Shimohigashi, and R. ?. Dutton, ?Short-channel MOSFET's in the punchthrough current mode?, Electron Devices, IEEE Transactions on, vol.26, issue.4, pp.44-153, 1979.

R. Chau, S. Datta, M. Doczy, B. Doyle, and J. Kavalieros, ?High-k/metal gate stack and its MOSFET characteristics?, Electron Device Letters, IEEE, vol.2, pp.408-410, 2004.
DOI : 10.1109/led.2004.828570

T. M. Klein, D. Niu, W. S. Epling, W. Li, and D. M. Maher, Evidence of aluminum silicate formation during chemical vapor deposition of amorphous Al2O3 thin films on Si(100), Applied Physics Letters, vol.75, issue.25, pp.4001-1003, 1999.
DOI : 10.1063/1.125519

J. Kwo, M. Hong, A. R. Kortan, K. T. Queeney, and Y. J. Chabal, High ?? gate dielectrics Gd2O3 and Y2O3 for silicon, Applied Physics Letters, vol.77, issue.1, pp.130-132, 2000.
DOI : 10.1063/1.126899

S. Guha, E. Cartier, M. A. Gribelyuk, N. A. Borjarczuk, and M. A. , Atomic beam deposition of lanthanum- and yttrium-based oxide thin films for gate dielectrics, Applied Physics Letters, vol.77, issue.17, pp.2710-2712, 2000.
DOI : 10.1063/1.1320464

M. T. Bohr, R. S. Chau, T. Chani, and K. Mistry, The High-k Solution, IEEE Spectrum, vol.44, issue.10, pp.29-35, 2007.
DOI : 10.1109/MSPEC.2007.4337663

G. D. Wilk, R. M. Walliace, and J. M. Anthony, High-?? gate dielectrics: Current status and materials properties considerations, Journal of Applied Physics, vol.89, issue.10, pp.243-5275, 2001.
DOI : 10.1063/1.1361065

C. Wee, S. Maikap, and C. Y. Yu, ?Mobility enhancement technologies?, Circuits and Devices Magazine, IEEE, vol.21, issue.3, pp.21-36, 2005.

Q. T. Nguyen, J. F. Damlencourt, B. Vincent, L. Clavelier, T. Morand et al., High quality Germanium-On-Insulator wafers with excellent hole mobility, Solid-State Electronics, vol.51, issue.9, pp.1172-1179, 2007.
DOI : 10.1016/j.sse.2007.07.015

URL : https://hal.archives-ouvertes.fr/hal-00393672

S. Thompson, G. Sun, K. ?u, J. Lim, and T. Nishida, ?Key differences for process-induced uniaxial vs. substrate-induced biaxial stressed Si and Ge channel MOSFETs, Electron Device Meeting, IEEE Technical Digest IEEE International, pp.221-224, 2004.

L. Pham-nguyen, C. Renouillet-beranger, G. Ghibaudo, T. Skotnicki, and S. Cristoloveanu, Mobility enhancement by CESL strain in short-channel ultrathin SOI MOSFETs, Solid-State Electronics, vol.54, issue.2, pp.123-130, 2010.
DOI : 10.1016/j.sse.2009.12.006

URL : https://hal.archives-ouvertes.fr/hal-00596348

J. P. Douglas, ?Si/SiGe heterostuctures: from material and physics to devices and circuits?, Semiconductor Science and Technology, vol.19, issue.10, pp.75-108, 2004.

L. Grenouillet, M. Vinet, J. Gimbert, B. Giraud, and J. P. Noel, ?UTBB SOI transistors with dual STI for a multi-?t strategy at 20 nm node and below?, Electron Devices Meeting, IEEE International, 2012.

W. Chaisantikulwat, M. Mouis, G. Ghibaudo, S. Cristoloveanu, and J. Widiez, Experimental evidence of mobility enhancement in short-channel ultra-thin body double-gate MOSFETs by magnetoresistance technique, Solid-State Electronics, vol.51, issue.11-12, pp.1494-1499, 2007.
DOI : 10.1016/j.sse.2007.09.017

URL : https://hal.archives-ouvertes.fr/hal-00393713

D. Jeon, S. J. Park, M. Mouis, M. Berthome, and S. Barraud, A new method for the extraction of flat-band voltage and doping concentration in Tri-gate Junctionless Transistors, Solid-State Electronics, vol.81, pp.113-118, 2013.
DOI : 10.1016/j.sse.2012.11.011

URL : https://hal.archives-ouvertes.fr/hal-01001935

R. Rios, A. Capellani, M. Armstrong, A. Budrevich, and H. Gomez, ?Comparison of junctionless and conventional trigate transistors with L g down to 2? nm?, Electron Devices Letters, IEEE, vol.32, issue.9, pp.1170-1172, 2011.

A. J. Strojwas, ?Is the bulk vs. SOI battle over??, ?LSI Technology, Systems and Applications, 2013, International Symposium on, pp.1-2, 2013.

G. Ghibaudo, New method for the extraction of MOSFET parameters, Electronics Letters, vol.24, issue.9, pp.543-545, 1988.
DOI : 10.1049/el:19880369

URL : https://hal.archives-ouvertes.fr/jpa-00227914

P. K. Malarty, S. Cristoloveanu, O. Faynot, V. Misra, and J. R. Hauser, A simple parameter extraction method for ultra-thin oxide MOSFETs, Solid-State Electronics, vol.38, issue.6, pp.1175-1177, 1995.
DOI : 10.1016/0038-1101(94)00248-E

C. G. Sodini, T. ?. Ekstedt, and J. L. Moll, ?Charge accumulation and mobility in thin dielectric MOS transistors?, Solid-Sate Electronics, pp.833-841, 1982.

G. Merckel, J. Borel, and N. Z. Cupcea, ?An accurate large-signal MOS transistor model for use in computeraided design?, Electron Device, IEEE Transactions on, vol.19, pp.81-690, 1872.

C. Hao, B. Cabon-till, S. Cristoloveanu, and G. Ghibaudo, ?Experimental determination of short-channel MOSFET parameters?, Solid-State Electronics, vol.28, issue.10, pp.1025-1030, 1985.

J. Koomen, Investigation of the MOST channel conductance in weak inversion, Solid-State Electronics, vol.16, issue.7, pp.801-810, 1973.
DOI : 10.1016/0038-1101(73)90177-9

P. C. Yeh and J. G. Fossum, ?Physical subthreshold MOSFET modeling applied to viable design of deepsubmicrometer fully depleted SOI low-voltage CMOS technology?, Electron Devices, IEEE Transactions on, vol.42, issue.9, pp.1605-1613, 1995.

T. Ernst, C. Tinella, C. Raynaud, and S. Cristoloveanu, Fringing fields in sub-0.1 ??m fully depleted SOI MOSFETs: optimization of the device architecture, Solid-State Electronics, vol.46, issue.3, pp.373-378, 2002.
DOI : 10.1016/S0038-1101(01)00111-3

T. Numate and S. Takagi, ?Device design for subtheshold slope and threshold voltage control in sub-100 nm fully depleted SOI MOSFETs?, Electron Devices, IEEE Transactions on, vol.1, issue.2, pp.21-22, 2004.

A. Vandooren, D. Jovanovic, S. Egley, M. Sadd, and B. Y. Nguyen, ?Scaling assessment of fully-depleted SOI technology at the 30 nm gate length generation?, SOI Conference, IEEE International, pp.2-27, 2002.

C. Maleville, ?Extending planar device roadmap beyond node 20 nm through ultra thin body technology?, VLSI Technology, Systems and Applications, 2011 International Symposium on, pp.1-4, 2011.
DOI : 10.1109/vtsa.2011.5872261

C. Gallon, Solutions alternatives avancées pour les prochaines générations de transistor CMOS SOI complètement déplété à simple grille, dissertation-INPG, 2007.

F. Gamiz, J. B. Roldan, and J. A. , Phonon-limited electron mobility in ultrathin silicon-on-insulator inversion layers, Journal of Applied Physics, vol.83, issue.9, pp.4802-4806, 1998.
DOI : 10.1063/1.367273

N. Xu, F. Andrieu, J. Jeon, X. Sun, and O. Weber, ?Stress induced performance enhancement in Si ultrathin body FD-SOI MOSFETs: Impacts of scaling?, ?LSI Technology, Symposium, pp.1-2, 2011.

Y. Omura, S. Horiguchi, M. Tabe, and K. Kishi, ?Quantum-mechanical effects on the threshold voltage of ultrathin-SOI nMOSFETs?, Electron Device Letters, IEEE, vol.14, issue.12, pp.9-571, 1993.

H. S. ?ong, D. J. Frank, and P. M. Solomon, ?Device design considerations for double-gate, ground-plane and single-gated ultra-thin SOI MOSFET's at the 2? nm channel length generation?, Electron Devices Meeting, Technical Digest. International, pp.407-410, 1998.

J. P. Denton and G. ?. Neudeck, ?Fully depleted dual-gated thin-film SOI P-MOSFETs fabricated in SOI islands with an isolated buried polysilicon backgate?, Electron Device Letters, IEEE, vol.17, issue.11, pp.9-511, 1996.

P. C. Yeh and J. G. Fossum, ??iable deep-submicron FD/SOI CMOS design for low-voltage applications?, SOI Confence, Proceedings, IEEE International, pp.23-24, 1994.

W. Liqiong, C. Zhanping, and K. Roy, ?Double gate dynamic threshold voltage (DGDT) SOI MOSFETs for low power high performance designs?, SOI Conference, Proceedings, IEEE International, pp.82-83, 1997.

F. Assaderaghi, D. Sinitsky, S. Parke, J. Bokor, and P. K. Ko, ?A dynamic threshold voltage MOSFET (DTMOS) for ultra-thin voltage operation?, Electron Devices Meeting, IEEE International, pp.809-812, 1994.

Y. Taur and T. H. Ning, Fundamentals of modern VLSI devices, 1998.

K. Tachi, S. Barraud, K. Kakushima, H. Iwai, and S. Cristoloveanu, Comparison of low-temperature electrical characteristics of gate-all-around nanowire FETs, Fin FETs and fully-depleted SOI FETs, Microelectronics Reliability, vol.51, issue.5, pp.885-888, 2011.
DOI : 10.1016/j.microrel.2011.01.004

K. Uchida, J. Koga, and S. Takagi, ?Experimental study on electron mobility in ultrathin-body silicon-oninsulator metal-oxide-semiconductor filed-effect transistors?, Journal of Applied Physics, vol.102, issue.7, pp.74-84, 2007.

S. Cristoloveanu and S. Li, Electrical characterization of silicon-on-insulator materials and devices, 1995.

M. J. Deen and Z. ?. Yan, DIBL in short-channel NMOS devices at 77 K, IEEE Transactions on Electron Devices, vol.39, issue.4, pp.908-915, 1992.
DOI : 10.1109/16.127482

J. C. ?oo and J. D. Plummer, ?Short-channel effects in MOSFET's at liquid-Nitrogen temperature?, Electron Devices, IEEE Transactions on, vol.33, issue.7, pp.1012-1019, 1986.

V. P. Trivedi, J. G. Fossum, and W. Zhang, Threshold voltage and bulk inversion effects in nonclassical CMOS devices with undoped ultra-thin bodies, Solid-State Electronics, vol.51, issue.1, pp.170-178, 2007.
DOI : 10.1016/j.sse.2006.10.014

O. Weber, F. Andrieu, J. Mazurier, M. Casse, and X. Garros, ?Work-function engineering in gate first technology for multi-V T dual-gate FDSOI CMOS on UTBOX?, Electron Device Meeting (IEDM), IEEE International, 2010.

F. Andrieu, O. Weber, J. Mazurier, O. Thomas, and J. ?. Noel, ?Low leakage and low variability Ultra- Thin Body and Buried Oxide (UT2B) SOI technology for 20nm low power CMOS and beyond?, VLSI Tech, 2010 Symposium on, pp.57-58, 2010.
DOI : 10.1109/vlsit.2010.5556122

P. Nguyen, F. Andrieu, X. Garros, J. Widiez, and G. Molas, ?Ultra-thin buried nitride integration for multi- V T , low-variability and power management in planar FDSOI CMOSFETs?, VLSI Tech, VLSIT), Symposium on, pp.164-165, 2010.

J. and ?. P. Colinge, Solid-State Electronics, ?Multiple-Gate SOI MOSFETs?, pp.897-905, 2004.

X. Huang, W. ?. Lee, C. Kuo, D. Hisamoto, and L. Chang, Sub-50 nm P-channel FinFET, IEEE Transactions on Electron Devices, vol.48, issue.5, pp.880-886, 2001.
DOI : 10.1109/16.918235

R. Chau, B. Doyle, J. Kavalieros, D. Barlage, and A. Murthy, Advanced Depleted-Substrate Transistors: Single-gate, Double-gate and Tri-gate, Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials, 2002.
DOI : 10.7567/SSDM.2002.D-1-1

K. , ?. I. Na, S. Cristoloveanu, Y. ?. Bae, P. Patruno et al., ?Short channel, floating body, and 3D coupling effects in triple-gate MOSFET?, Int. J. High Speed Electron. Sys, vol.18, issue.4, pp.773-782, 2008.

A. Ohata, S. Cristoloveanu, and M. Casse, Mobility comparison between front and back channels in ultrathin silicon-on-insulator metal-oxide-semiconductor field-effect transistors by the front-gate split capacitance-voltage method, Applied Physics Letters, vol.89, issue.3, p.32104
DOI : 10.1063/1.2222255

K. Akarvardar, A. Mercha, S. Cristoloveanu, P. Gentil, and E. Simoen, ?A two-dimensional model for interface coupling in triple-gate transistors?, Electron Devices, IEEE Transactions on, vol.4, issue.4, pp.7-7, 2007.

S. Chang, M. Bawedin, Y. Guo, F. Liu, and K. Akarvardar, ?Enhanced coupling effects in vertical double-gate FinFETs? under review for Solid-State Electronics

M. Casse, J. Pretet, S. Cristoloveanu, T. Poiroux, and C. Fenouillet-beranger, ?Gate-induced floatingbody effect in fully-depleted SOI MOSFETs with tunneling oxide and back-gate biasing?, Solid-State Electronics, vol.48, issue.7, pp.1242-1247, 2004.

B. Bayraktaroglu, K. Leedy, and R. Neidhard, NANOCRYSTALLINE HIGH PERFORMANCE THIN FILM TRANSISTORS, International Journal of High Speed Electronics and Systems, vol.20, issue.01, pp.171-182, 2011.
DOI : 10.1142/S0129156411006507

K. Minegishi, Y. Koiwai, Y. Kikuchi, K. Yano, and M. Kasuga, Growth of p-type Zinc Oxide Films by Chemical Vapor Deposition, Japanese Journal of Applied Physics, vol.36, issue.Part 2, No. 11A, pp.1453-1455, 1997.
DOI : 10.1143/JJAP.36.L1453

M. Joseph, H. Tabata, and T. Kawai, p-Type Electrical Conduction in ZnO Thin Films by Ga and N Codoping, Japanese Journal of Applied Physics, vol.38, issue.Part 2, No. 11A, pp.1205-1207, 1999.
DOI : 10.1143/JJAP.38.L1205

S. Masuda, K. Kitamura, Y. Okumura, S. Miyatake, and T. Hitoshi, Transparent thin film transistors using ZnO as an active channel layer and their electrical properties, Journal of Applied Physics, vol.93, issue.3, pp.1624-1630, 2003.
DOI : 10.1063/1.1534627

J. Song, J. Park, H. Kim, Y. Heo, and J. Kim, Transparent amorphous indium zinc oxide thin-film transistors fabricated at room temperature, Applied Physics Letters, vol.90, issue.2, p.22106, 2007.
DOI : 10.1063/1.2430917

O. Yutaka, N. Tsukasa, B. Takayuki, and T. Yasutaka, ?Thin film transistor of ZnO fabricated by chemical solution deposition?, Jpn. J. Appl. Phys, vol.40, issue.1, pp.297-298, 2001.

F. X. Xiu, Z. Yang, L. J. Mandalapu, D. T. Zhao, and J. L. Liu, High-mobility Sb-doped p-type ZnO by molecular-beam epitaxy, Applied Physics Letters, vol.87, issue.15, p.152101, 2005.
DOI : 10.1063/1.2089183

M. Antonio, ?Wide-bandgap high-mobility ZnO thin-film transistors produced at room temperature?, Appl. Phys. Lett, vol.85, issue.13, pp.2541-2543, 2004.

D. Redinger and ?. Subramanian, High-Performance Chemical-Bath-Deposited Zinc Oxide Thin-Film Transistors, IEEE Transactions on Electron Devices, vol.54, issue.6, pp.1301-1307, 2007.
DOI : 10.1109/TED.2007.895861

D. A. Mourey, D. A. Zhao, J. Sun, and T. N. Jackson, Fast PEALD ZnO Thin-Film Transistor Circuits, IEEE Transactions on Electron Devices, vol.57, issue.2, pp.530-534, 2010.
DOI : 10.1109/TED.2009.2037178

S. Yoshizawa, K. Nishimura, and T. Sakurai, Preparation of ZnO thin film by newly designed horizontal-typed MOCVD chamber, Journal of Physics: Conference Series, vol.100, issue.8, 2008.
DOI : 10.1088/1742-6596/100/8/082052

B. J. Norris, J. Anderson, J. F. Wager, and D. A. Keszler, Spin-coated zinc oxide transparent transistors, Journal of Physics D: Applied Physics, vol.36, issue.20, pp.105-107, 2003.
DOI : 10.1088/0022-3727/36/20/L02

K. Nomura, H. Ohta, A. Takagi, T. Kamiya, and M. Hirano, Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors, Nature, vol.26, issue.7016, pp.488-492, 2004.
DOI : 10.1002/adma.200304947

B. Bayraktaroglu and K. Leedy, Pulsed Laser Deposited ZnO for Thin Film Transistor Applications, ECS Transactions, pp.61-73, 2008.
DOI : 10.1149/1.2985844

M. D. Jacunski, M. S. Shur, and M. Hack, ?Threshold voltage, field effect mobility, and gate-to-channel capacitance in polysilicon TFTs?, Electron Device, IEEE Transaction on, vol.43, issue.9, pp.1433-1440, 1996.

A. T. Hatzopoulos, D. H. Tassis, C. A. Dimitriadis, and G. Kamarinos, Analytical on-state current model of polycrystalline silicon thin-film transistors including the kink effect, Applied Physics Letters, vol.87, issue.6, pp.0-4
DOI : 10.1063/1.2007859

M. D. Jacunski, M. S. Shur, A. A. Owusu, T. Ytterdal, and M. Hack, A short-channel DC SPICE model for polysilicon thin-film transistors including temperature effects, IEEE Transactions on Electron Devices, vol.46, issue.6, pp.1146-1158, 1999.
DOI : 10.1109/16.766877

M. Wang and M. Wong, An Effective Channel Mobility-Based Analytical On-Current Model for Polycrystalline Silicon Thin-Film Transistors, IEEE Transactions on Electron Devices, vol.54, issue.4, pp.869-874, 2007.
DOI : 10.1109/TED.2007.891248

R. L. Hoffman, ZnO-channel thin-film transistors: Channel mobility, Journal of Applied Physics, vol.95, issue.10, p.5813, 2004.
DOI : 10.1063/1.1712015

F. Torricelli, J. R. Meijboom, E. Smits, A. K. Tripathi, and M. Ferroni, Transport Physics and Device Modeling of Zinc Oxide Thin-Film Transistors Part I: Long-Channel Devices, IEEE Transactions on Electron Devices, vol.58, issue.8, pp.2610-2619, 2011.
DOI : 10.1109/TED.2011.2155910

F. Torricelli, E. Smits, J. R. Meijboom, A. K. Tripathi, and G. H. Gelinck, Transport Physics and Device Modeling of Zinc Oxide Thin-Film Transistors—Part II: Contact Resistance in Short Channel Devices, IEEE Transactions on Electron Devices, vol.58, issue.9, pp.3025-3033, 2011.
DOI : 10.1109/TED.2011.2159929

M. Grundmann, H. Frenzel, A. Lajn, M. Lorenz, and F. , Transparent semiconducting oxides: materials and devices, physica status solidi (a), vol.30, issue.6, pp.1437-1449, 2010.
DOI : 10.1002/pssa.200983771

U. Oezguer, Y. I. Alivov, C. Liu, A. Teke, and M. A. Reshchikov, A comprehensive review of ZnO materials and devices, Journal of Applied Physics, vol.98, issue.4, p.41301
DOI : 10.1063/1.1992666

C. Klingshirn, ZnO: Material, Physics and Applications, ChemPhysChem, vol.143, issue.342, pp.782-803, 2007.
DOI : 10.1002/cphc.200700002

A. R. Hutson, Hall Effect Studies of Doped Zinc Oxide Single Crystals, Physical Review, vol.108, issue.2, pp.222-230, 1957.
DOI : 10.1103/PhysRev.108.222

C. Jagadish and S. Pearton, Zinc oxide bulk, thin films and nanostructures: processing, properties, and applications, 2011.

R. L. Hoffman, B. J. Norris, and J. F. Wager, ZnO-based transparent thin-film transistors, Applied Physics Letters, vol.82, issue.5, pp.733-735, 2003.
DOI : 10.1063/1.1542677

P. F. Carcia, R. S. Mclean, and M. H. Reilly, High-performance ZnO thin-film transistors on gate dielectrics grown by atomic layer deposition, Applied Physics Letters, vol.88, issue.12, p.123509, 2006.
DOI : 10.1063/1.2188379

J. L. Vossen, H. Chaudhari, and . Raether, Physics of thin films, 1997.

R. J. Lad, P. D. Funkenbusch, and C. R. Aita, Postdeposition annealing behavior of rf sputtered ZnO films, Journal of Vacuum Science and Technology, vol.17, issue.4, pp.808-811, 1980.
DOI : 10.1116/1.570565

P. Fons, K. Iwata, S. Niki, A. Yamada, and K. Matsubara, Uniaxial locked growth of high-quality epitaxial ZnO films on -Al2O3, Journal of Crystal Growth, vol.209, issue.2-3, pp.532-536, 2000.
DOI : 10.1016/S0022-0248(99)00614-4

C. K. Lau, S. K. Tiku, and K. M. Lakin, Growth of Epitaxial ZnO Thin Films by Organometallic Chemical Vapor Deposition, Journal of The Electrochemical Society, vol.127, issue.8, pp.1843-1847, 1980.
DOI : 10.1149/1.2130012

Y. Kashiwaba, K. Haga, H. Watanabe, B. P. Zhang, and Y. , Structures and Photoluminescence Properties of ZnO Films Epitaxially Grown by Atmospheric Pressure MOCVD, physica status solidi (b), vol.76, issue.2, pp.921-924, 2002.
DOI : 10.1002/1521-3951(200201)229:2<921::AID-PSSB921>3.0.CO;2-N

J. J. Robbins, J. Esteban, C. Fry, and C. , A. ?olden. ?An investigation of the plasma chemistry involved in the synthesis of ZnO by PEC?D?, Journal of Electrochemical Society, vol.1, issue.010, pp.693-698, 2003.
URL : https://hal.archives-ouvertes.fr/inria-00072573

B. S. Li, Y. C. Liu, D. Z. Shen, Y. M. Lu, and J. Y. Zhang, Growth of high quality ZnO thin films at low temperature on Si(100) substrates by plasma enhanced chemical vapor deposition, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol.20, issue.1, pp.265-269, 2002.
DOI : 10.1116/1.1430427

D. H. Levy, D. Freeman, S. F. Nelson, P. J. Cowdery-corvan, and J. Peter, Stable ZnO thin film transistors by fast open air atomic layer deposition, Applied Physics Letters, vol.92, issue.19, 2008.
DOI : 10.1063/1.2924768

D. B. Christey and G. K. Hubler, Pulsed laser deposition of thin films, 2003.

S. Cristoloveanu, D. Munteanu, and M. S. Liu, A review of the pseudo-MOS transistor in SOI wafers: operation, parameter extraction, and applications, IEEE Transactions on Electron Devices, vol.47, issue.5, pp.1018-1027, 2000.
DOI : 10.1109/16.841236

M. S. Shur, H. C. Slade, M. D. Jacunski, A. A. Owusu, and T. , SPICE Models for Amorphous Silicon and Polysilicon Thin Film Transistors, Journal of The Electrochemical Society, vol.144, issue.8, pp.2833-2839, 1997.
DOI : 10.1149/1.1837903

D. J. Grant, Physics and Modeling of Nanocrystalline Silicon Thin-Film Transistors, 2003.

D. Dosev, T. Ytterdal, J. Pallares, L. F. Marsal, and B. Iniquez, DC SPICE model for nanocrystalline and microcrystalline silicon TFTs, IEEE Transactions on Electron Devices, vol.49, issue.11, pp.1979-1984, 2002.
DOI : 10.1109/TED.2002.804719

T. Hirao, M. Furuta, T. Hiramatsu, T. Matsuda, C. Furuta et al., Bottom-Gate Zinc Oxide Thin-Film Transistors (ZnO TFTs) for AM-LCDs, IEEE Transactions on Electron Devices, vol.55, issue.11, pp.3136-3142, 2008.
DOI : 10.1109/TED.2008.2003330

R. Navamathavan, C. K. Choi, E. J. Yang, J. H. Lim, and D. K. Hwang, Fabrication and characterizations of ZnO thin film transistors prepared by using radio frequency magnetron sputtering, Solid-State Electronics, vol.52, issue.5, pp.813-816, 2008.
DOI : 10.1016/j.sse.2007.11.010

S. Cristoloveanu, ?State-of-the-art and future of silicon on insulator technologies, materials, and devices?, Microelectronics Reliability, pp.771-777, 2000.

T. Elewa, F. Balestra, S. Cristoloveanu, I. M. Hafez, and J. P. , Performance and physical mechanisms in SIMOX MOS transistors operated at very low temperature, IEEE Transactions on Electron Devices, vol.37, issue.4, pp.1007-1019, 1990.
DOI : 10.1109/16.52436

H. S. Wong, M. H. White, T. J. Krutsic, and R. V. Booth, ?Modeling of transconductance degradation and extraction of threshold voltage in thin oxide MOSFET's?, Solid-State Electronics, pp.953-968, 1987.

A. Emrani, F. Balestra, and G. Ghibaudo, Low temperature electrical characterization of metal???nitrided oxide???silicon field effect transistors, Journal of Applied Physics, vol.73, issue.10, pp.1821-1831, 1993.
DOI : 10.1063/1.353753

J. Levinson, F. R. Shepherd, W. D. Westwood, G. Este, and M. Rider, Conductivity behavior in polycrystalline semiconductor thin film transistors, Journal of Applied Physics, vol.53, issue.2, pp.1193-1202, 1982.
DOI : 10.1063/1.330583

F. V. Farmakis, J. Brini, G. Kamarinos, C. T. Angelis, and C. A. , On-current modeling of large-grain polycrystalline silicon thin-film transistors, IEEE Transactions on Electron Devices, vol.48, issue.4, pp.701-706, 2001.
DOI : 10.1109/16.915695

N. Rodriguez, S. Cristoloveanu, and F. Gamiz, Revisited Pseudo-MOSFET Models for the Characterization of Ultrathin SOI Wafers, IEEE Transactions on Electron Devices, vol.56, issue.7, pp.1507-1515, 2009.
DOI : 10.1109/TED.2009.2021715

G. Hamaide, F. Allibert, H. Hovel, and S. Cristoloveanu, Impact of free-surface passivation on silicon on insulator buried interface properties by pseudotransistor characterization, Journal of Applied Physics, vol.101, issue.11, pp.114513-114514, 2007.
DOI : 10.1063/1.2745398

URL : https://hal.archives-ouvertes.fr/hal-00393059

A. T. Hatzopoulous, D. H. Tassis, N. A. Hastas, C. A. Dimitriadis, and G. Kamarinos, On-State Drain Current Modeling of Large-Grain Poly-Si TFTs Based on Carrier Transport Through Latitudinal and Longitudinal Grain Boundaries, IEEE Transactions on Electron Devices, vol.52, issue.8, pp.1727-1733, 2005.
DOI : 10.1109/TED.2005.852732

M. Mouis, G. Ghibaudo, S. Cristoloveanu, J. Widiez, and M. Vinent, ?Experimental evidence of mobility enhancement in short-channel ultra-thin body double-gate MOSFETs?, Proc. EESDERC, pp.367-370, 2006.

A. Ohata, Y. Bae, C. Fenouillet-beranger, and S. Cristoloveanu, ?Mobility enhancement by back-gate biasing in ultrathin SOI MOSFETs with thin BO??, Electron Device Letters, IEEE, vol.33, issue.3, pp.348-350, 2012.

S. Cristoloveanu, N. Rodriguez, and F. Gamiz, Why the Universal Mobility Is Not, IEEE Transactions on Electron Devices, vol.57, issue.6, pp.1327-1333, 2010.
DOI : 10.1109/TED.2010.2046109

URL : https://hal.archives-ouvertes.fr/hal-00596198

C. Navarro, N. Rodriguez, A. Ohata, F. Gamiz, and F. , Adrieu, et al. ?Multibranch mobility analysis for the characterization of FD SOI transistors?, Electron Device Letter, IEEE, vol.33, issue.8, pp.1102-1104, 2012.

O. M. Corbino, ?Electomagnetic effects resulting from the distortion of the path of ions in metals produced by a filed?, pp.1-568, 1911.

Y. M. Meziani, J. Lusakowski, W. Knap, D. Dyakonova, and F. , Magnetoresistance characterization of nanometer Si metal-oxide-semiconductor transistors, Journal of Applied Physics, vol.96, issue.10, pp.5761-5765, 2004.
DOI : 10.1063/1.1806991

W. Chaisantikulwat, M. Mouis, G. Ghibaudo, C. Gallon, C. Fenouillet et al., Differential magnetoresistance technique for mobility extraction in ultra-short channel FDSOI transistors, Solid-State Electronics, vol.50, issue.4, pp.637-643, 2006.
DOI : 10.1016/j.sse.2006.03.035

URL : https://hal.archives-ouvertes.fr/hal-00145113

M. Casse, F. Rochette, L. Thevenod, N. Bhouri, and F. Andrieu, A comprehensive study of magnetoresistance mobility in short channel transistors: Application to strained and unstrained silicon-on-insulator field-effect transistors, Journal of Applied Physics, vol.105, issue.8, pp.84-87, 2009.
DOI : 10.1063/1.3097764

URL : https://hal.archives-ouvertes.fr/hal-00596113

S. Cristoloveanu, T. V. Chandrasekhar-rao, Q. T. Nguyen, J. Antoszewsk, and H. , The Corbino Pseudo-MOSFET on SOI: Measurements, Model, and Applications, IEEE Transactions on Electron Devices, vol.56, issue.3, pp.474-482, 2009.
DOI : 10.1109/TED.2008.2011573

URL : https://hal.archives-ouvertes.fr/hal-00596090

P. R. Jay and R. H. ?allis, ?Magnetotransconductance mobility measurements of GaAs MESFETs?, Electron Device Letters, IEEE, vol.2, issue.10, pp.265-267, 1981.

K. Chen, H. C. ?ann, P. K. Ko, and C. Hu, ?The impact of device scaling and power supply change on CMOS gate performance?, Electron Device Letters, IEEE, vol.17, pp.202-204, 1996.

J. T. ?att and J. D. Plummer, ?Universal mobility-field curve for electrons and holes in MOS inversion layers?, ?LSI Technology, Digest of Technical Papers. Symposium on, pp.81-82, 1987.

L. Donetti, F. Gamiza, and S. Cristoloveanu, Monte Carlo simulation of Hall and magnetoresistance mobility in SOI devices, Solid-State Electronics, vol.51, issue.9, pp.1216-1220, 2007.
DOI : 10.1016/j.sse.2007.07.022

URL : https://hal.archives-ouvertes.fr/hal-00393671

A. Cros, K. Romanjek, D. Fleury, S. Harrison, and R. Cerutti, ?Unexpected mobility degradation for very short devices: A new challenge for CMOS scaling?, Electron Devices Meeting, pp.1-4, 2006.

L. D. Tau, ?A simply theory to predict the threshold voltage of short-channel IGFET's?, Solid-State Electronics, pp.1059-1063, 1974.

A. L. Perin and R. Giacomini, ?Sensing magnetic fields in any direction using FinFETs and L-Gate FinFETs?, SOI Conference, IEEE International, pp.1-2, 2012.

W. A. Back and J. R. Anderson, ?Determination of electrical transport properties using a novel magnetic fielddependent Hall technique?, Journal of Applied Physics, vol.2, issue.2, pp.41-554, 1981.

I. Vurgaftman, J. R. Meyer, C. A. Hoffman, D. Redfern, and J. Antoszewski, Improved quantitative mobility spectrum analysis for Hall characterization, Journal of Applied Physics, vol.84, issue.9, pp.49-4973, 1998.
DOI : 10.1063/1.368741

K. Oshima, S. Cristoloveanu, B. Guillaumot, H. Iwai, and S. Deleonibus, Advanced SOI MOSFETs with buried alumina and ground plane: self-heating and short-channel effects, Solid-State Electronics, vol.48, issue.6, pp.907-917, 2004.
DOI : 10.1016/j.sse.2003.12.026

P. Patruno, M. Kostrzewa, K. Landry, W. Xiong, and C. R. Cleavelin, Study of Fin Profiles and MuGFETs built on SOI Wafers with a Nitride-Oxide Buried Layer (NOx-BL) as the Buried Insulator Layer, 2007 IEEE International SOI Conference, pp.51-52, 2007.
DOI : 10.1109/SOI.2007.4357847

R. Ranica, A. Villaret, P. Mazoyer, S. Monfray, and D. Chanemougame, A New 40-nm SONOS Structure Based on Backside Trapping for Nanoscale Memories, IEEE Transactions On Nanotechnology, vol.4, issue.5
DOI : 10.1109/TNANO.2005.851416

H. Silva and S. Tiwari, A Nanoscale Memory and Transistor Using Backside Trapping, IEEE Transactions On Nanotechnology, vol.3, issue.2, pp.264-269, 2004.
DOI : 10.1109/TNANO.2004.828532

H. J. Sung-hwan-kim and . Bae, et al. ?High performance Silicon-on-ONO (SOONO) cell array transistors (SCATs) for 512Mb DRAM cell array application?, Electron Devices Meeting, IEEE International, pp.35-38, 2007.

A. Hubert, E. Nowak, K. Tachi, V. Maffini-alvaro, and C. Vizioz, A stacked SONOS technology, up to 4 levels and 6nm crystalline nanowires, with Gate-All-Around or independent gates (&#x03C6;-Flash), suitable for full 3D integration, 2009 IEEE International Electron Devices Meeting (IEDM), pp.1-4, 2009.
DOI : 10.1109/IEDM.2009.5424260

C. Woo-oh, N. Y. Kim, S. H. Kim, Y. L. Choi, and S. I. Hong, ?4-bit double SONOS memories (DSMs) using single-level and multi-level cell schemes?, Electron Devices Meeting, IEEE International, pp.1-4, 2006.

. Aritome, ?Advanced flash memory technology and trends for file storage application?, Electron Devices Meeting, IEDM Technical Digest. International, pp.763-766, 2000.

I. W. Cho, B. R. Lim, J. Kim, S. S. Kim, and . Kim, ?Full integration and characterization of Localized ONO Memory (LONOM) for embedded flash technology?, VLSI Technology, Digest of Technical Papers, pp.240-241, 2004.

C. C. Yeh, W. J. Tsai, T. C. Lu, H. Y. Chen, and H. C. Lai, ?Novel operation schemes to improve device reliability in a localized trapping storage SONOS-type Flash memory?, Electron Devices Meeting, IEDM '03 Technical Digest. IEEE International, 2003.

S. Sungm, I. C. Park, Y. K. Lee, J. D. Lee, and . Lee, ?Fabrication and program/erase characteristics of 30 nm SONOS nonvolatile memory devices?, Nanotechnology IEEE Transactions on

H. C. ?ann and C. Hu, ?High endurance ultra thin tunneling oxide in MONOS device structure for dynamic memory application? Electron Device Letters, pp.491-493, 1995.

S. Minami and Y. Kamigaki, A novel MONOS nonvolatile memory device ensuring 10-year data retention after 10/sup 7/ erase/write cycles, IEEE Transactions on Electron Devices, vol.40, issue.11, pp.2011-2017, 1993.
DOI : 10.1109/16.239742

F. Masuoka, M. Momodomi, Y. Iwata, and R. Shirota, ?New ultra high density EPROM and Flash with NAND structure cell?, Electron Devices Meeting, International, pp.2-555, 1987.
DOI : 10.1109/iedm.1987.191485

S. Lai, ?Flash memories: ?here we were and where we are going?, Electron Devices Meeting, pp.971-973, 1998.
DOI : 10.1109/iedm.1998.746516

P. Pavan, R. Bez, P. Olivo, and E. Zanoni, Flash memory cells-an overview, Proceedings of the IEEE, pp.1248-1271, 2002.
DOI : 10.1109/5.622505

URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.323.6913

Y. Shin, J. Choi, C. Kang, C. Lee, K. Park et al., ?A novel NAND-type MONOS memory using 63 nm process technology for multi-gigabit flash EEPROMs?, Electron Device Meeting, pp.327-330, 2005.

P. Cappelletti, R. Bez, D. Cantarelli, and L. Fratin, ?Failure mechanisms of flash cell in program/erase cycling?, Electron Devices Meeting, pp.291-294, 1994.

C. Clementi and R. Bez, Non Volatile Memory Technologies: Floating Gate Concept Evolution, MRS Proceedings D1.2.1-D1.2.12, 2004.
DOI : 10.1002/qre.4680080305

K. Kim and J. Choi, ?Future outlook of NAND flash technology for 40 nm node and beyond?, Non-Volatile Semiconductor Memory Workshop, pp.9-11, 2006.

K. Naruke, S. Taguchi, and M. ?ada, ?Stress induced leakage current limiting to scale down EEPROM tunnel oxide thickness?, Electron Device Meeting, Technical Digest, IEEE International, pp.424-427, 1988.

J. S. ?itters, G. Groeseneken, and H. E. Maes, ?Degradation of tunnel oxide floating gate EEPROM of thin gate oxide?, Electron Devices, IEEE Transactions on, vol.3, issue.9, pp.1-3, 1989.

C. Lu, K. Y. Hsieh, and R. Liu, Future challenges of flash memory technologies, Microelectronic Engineering, vol.86, issue.3, pp.283-286, 2009.
DOI : 10.1016/j.mee.2008.08.007

B. De-salvo, C. Gerardi, S. Lombardo, T. Baron, L. Perniola et al., ?How far will silicon nanocrystals push the scaling limits of N?Ms technologies??, Electron Device Meeting, 2003.

R. Bez, E. Camerlenghi, and A. Pirovano, Materials and Processes for Non-Volatile Memories, Materials Science Forum, vol.608, pp.111-132, 2009.
DOI : 10.4028/www.scientific.net/MSF.608.111

K. Joo, X. Wang, J. H. Han, S. Lim, and S. Baik, ?Novel transition layer engineered Si nanocrystal flash memory with MHSOS structure featuring large V th window and fast P/E speed?, Electron Device Meeting, pp.765-868, 2005.

C. H. Lee, K. I. Choi, M. Cho, Y. Song, and K. Park, ?A novel SONOS structure of SiO 2 /SiN/Al 2 O 3 with TaN metal gate for multi-gigabit flash memories?, Electron Device Meeting, pp.613-616, 2003.

Y. Fukuzumi, Y. Matsuoka, M. Kito, M. Kido, and M. Sato, ?Optimal integration and characteristics of vertical array devices for ultra-high density, bit-cost scalable flash memory?, Electron Devices Meeting, IEEE International, pp.449-452, 2007.

F. Pellizzer and R. Bez, Non-Volatile semiconductor memories for nano-scale technology, 10th IEEE International Conference on Nanotechnology, pp.21-24, 2010.
DOI : 10.1109/NANO.2010.5697736

J. E. Spanier, A. M. Kolpak, J. J. Urban, I. Grinberg, and L. Ouyang, ?Ferroelectric phase transition in individual single-crystalline BaTiO 3 Nanowires?, Nano Letter, vol.?, issue.4, pp.73-739, 2006.

S. Tehrani, J. M. Slaughter, M. Deherrera, B. N. Engel, and N. D. Rizzo, Magnetoresistive random access memory using magnetic tunnel junctions, Proceedings of IEEE, pp.703-714, 2003.
DOI : 10.1109/JPROC.2003.811804

M. Kawasaki, A. Sawa, and Y. Tokura, Mechanisms of Resistance Switching Memory Effect in Oxides, Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials, pp.286-287, 2006.
DOI : 10.7567/SSDM.2006.C-5-1

A. Chen, S. Haddad, Y. Wu, T. Fang, and Z. Lan, ?Non-volatile resistive switching for advanced memory applications?, Electron Devices Meeting, pp.74-749, 2005.

I. G. Baek, D. C. Kim, M. J. Lee, H. Kim, and E. K. Yim, ?Multi-layer cross-point binary oxide resistive memory (OxRAM) for post-NAND storage application?, Electron Devices Meeting, pp.750-753, 2005.
DOI : 10.1109/iedm.2005.1609462

S. Lai and T. Lowrey, ?OUM-A 180nm nonvolatile memory cell element technology for stand alone and embedded applications?, Electron Devices Meeting, 2001.

M. Gill, T. Lowrey, and J. Park, ?Ovonic unified memory-a high-performance nonvolatile memory technology for stand-alone memory and embedded applications?, Solid-State Circuits Conference, Digest of Technical papers. IEEE International, pp.202-459, 2002.

H. Horii, J. H. Yi, J. H. Park, Y. H. Ha, and I. G. Baek, ?A novel cell technology using N-doped GeSbTe films for phase change RAM?, ?LSI technology, Digest of Technical papers. Symposium on, pp.177-178, 2003.

M. H. Lankhorst, B. ?. Ketelaars, and R. A. ?olters, Low-cost and nanoscale non-volatile memory concept for future silicon chips, Nature Materials, vol.95, issue.4, pp.347-352, 2005.
DOI : 10.1038/nmat1350

A. Pirovano, A. Redaelli, F. Pellizzer, F. Ottogalli, and M. Tosi, ?Reliability study of phase-change nonvolatile memories?, Device and Material Reliability, IEEE Transactions on, vol.4, issue.3, pp.422-427, 2004.

S. Chang, K. Na, M. Bawedin, Y. Bae, and K. Park, Investigation of hysteresis memory effects in SOI FinFETs with ONO buried insulator, 2010 IEEE International SOI Conference (SOI), pp.1-2, 2010.
DOI : 10.1109/SOI.2010.5641374

URL : https://hal.archives-ouvertes.fr/hal-00604643

F. Dauge, J. Pretet, S. Cristoloveanu, A. Vandooren, and L. Mathew, Coupling effects and channels separation in FinFETs, Solid-State Electronics, vol.48, issue.4, pp.535-542, 2004.
DOI : 10.1016/j.sse.2003.09.033

R. Bez, E. Camerlenghi, A. Modelli, and A. ?isconti, Introduction to flash memory, Proceedings of the IEEE, vol.91, issue.4, pp.489-502, 2003.
DOI : 10.1109/JPROC.2003.811702

T. Ouisse, S. Cristoloveanu, and G. Borel, ?Hot-carrier-induced degradation of the back interface in shortchannel silicon-on-insulator MOSFETS?, Electron Device Letters, IEEE, vol.12, issue.6, pp.290-292, 1991.

S. Cristoloveanu, A Review of the Electrical Properties of SIMOX Substrates and Their Impact on Device Performance, Journal of The Electrochemical Society, vol.138, issue.10, pp.3131-3139, 1991.
DOI : 10.1149/1.2085381

T. Ouisse, S. Cristoloveanu, and G. Borel, ?Electron trapping in irradiated SIMOX buried oxides?, Electron Device Letters, pp.312-314, 1991.

M. Grossi, M. Lanzoni, and R. Ricco, Program Schemes For Multilevel Flash Memories, Proceedings of the IEEE, vol.91, issue.4, pp.594-601, 2003.
DOI : 10.1109/JPROC.2003.811714

Y. ?ang and M. H. ?hite, ?An analytical retention model for SONOS nonvolatile memory devices in the excess electron state?, Solid-State Electronics, vol.49, issue.1, pp.97-107, 2005.

D. Lee, W. Kim, J. Lee, and B. Park, ?Thickness-dependence of oxide-nitride-oxide erase property in SONOS flash memory?, Semiconductor Device Research Symposium, ISDRS '09, pp.1-2, 2009.

S. Gu, C. Hsu, T. Wang, W. Lu, and Y. Ku, Numerical Simulation of Bottom Oxide Thickness Effect on Charge Retention in SONOS Flash Memory Cells, IEEE Transactions on Electron Devices, vol.54, issue.1, pp.90-97, 2007.
DOI : 10.1109/TED.2006.887219

Y. Bae, K. Na, S. Cristoloveanu, W. Xiong, and C. R. Cleavelin, ?Special effects in triple gate MOSFETs fabricated on silicon-on-insulator (SOI)?, Semiconductor Conference, pp.51-56, 2009.

D. E. Deok-su-jeon and . Burk, MOSFET electron inversion layer mobilities-a physically based semi-empirical model for a wide temperature range, IEEE Transactions on Electron Devices, vol.36, issue.8, pp.1456-1463, 2002.
DOI : 10.1109/16.30959

W. J. Tsai, N. K. Zous, C. J. Liu, C. C. Liu, and C. H. Chen, ?Data retention behavior of a SONOS type twobit storage Flash memory cell?, Electron Devices Meeting, 2001.

S. Okhonin, M. Nagoga, E. Carman, R. Beffa, and E. Faraoni, ?New generation of Z-RAM?, Electron Devices Meeting, IEEE International, pp.925-928, 2007.

H. S. Seo, G. Kang, S. Kang, Y. K. Young, and S. Lee, Dynamic bias temperature instability-like behaviors under Fowler???Nordheim program/erase stress in nanoscale silicon-oxide-nitride-oxide-silicon memories, Applied Physics Letters, vol.92, issue.13, p.133508, 2008.
DOI : 10.1063/1.2905272

J. Han, S. Ryu, C. Kim, S. Kim, and M. Im, ?Partially depleted SONOS FinFET for unified RAM (URAM)?Unified function for high-speed 1T DRAM and nonvolatile memory?, Electron Device Letters, pp.781-783, 2008.

D. Bae, S. Ryu, B. Gu, and Y. Choi, A new approach to cell size scaling with a multi-dual cell and a buffer/background programming of unified RAM, Microelectronic Engineering, vol.87, issue.2, pp.135-138, 2010.
DOI : 10.1016/j.mee.2009.06.027

M. Bawedin, S. Cristoloveanu, A. Hubert, J. H. Park, and F. Martinez, Floating-Body SOI Memory: The Scaling Tournament, Semiconductor-On-Insulator Materials for Nanoelectronic Applications
DOI : 10.1007/978-3-642-15868-1_21

R. Ranica, A. Vilaret, C. Fenouillet-beranger, P. Malinge, and P. Mazoyer, ?A capacitor-less DRAM cell on 75nm gate length, 16nm thin fully depleted SOI device for high density embedded memories?, Electron Device Meeting, IEEE International, pp.277-280, 2004.

M. S. Kim and W. Cho, ?Characteristics of Fully Depleted Strained-Silicon-On-Insulator Capacitorless Dynamic Random Access Memory Cells?, Electron Device Letters, pp.1356-1358, 2009.

L. Chang, D. M. Fried, J. Hergenrother, J. W. Sleight, and R. H. Dennard, ?Stable SRAM cell design for the 32 nm node and beyond?, ?LSI Technology, pp.128-129, 2005.

T. Eimori, Y. Ohno, H. Kimura, J. Matsufusa, S. Kishimura et al., ?A newly designed planar stacked capacitor cell with high dielectric constant film for 2?? MBIT DRAM?, Electron Device Meeting, pp.631-634, 1993.

C. J. Radens, S. Kudelka, L. Nesbit, R. Malik, and T. Dyer, ?An orthogonal ?F 2 trench-sidewall vertical device cell for 4GB/1?GB DRAM?, Electron Deivce Meeting, pp.349-352, 2000.

G. Aichmayr, A. Avellan, G. S. Duesberg, F. Lreupl, and S. Kudelka, ?Carbon/high-k trench capacitor for the 40 nm DRAM generation?, ?LSI Technology, IEEE Symposium on, pp.18-187, 2007.

S. Okhonin, M. Nagoga, J. M. Sallese, and P. Fazan, ?A SOI capacitor-less 1T-DRAM concept?, SOI Conference, IEEE International, pp.153-154, 2001.

S. Okhonin, M. Nagoga, J. M. Sallese, and P. Fazan, ?A SOI capacitor-less 1T-DRAM cell?, Electron Device Letters, pp.85-87, 2002.

C. Kuo, T. King, and C. Hu, A capacitorless double gate DRAM technology for sub-100-nm embedded and stand-alone memory applications, IEEE Transactions on Electron Devices, vol.50, issue.12, pp.2408-2416, 2003.
DOI : 10.1109/TED.2003.819257

T. Shino, T. Ohsawa, T. Higashi, K. Fujita, and N. Kusunoki, ?Operation voltage dependence of memory cell characteristics in fully depleted floating-body cell?, Electron Devices, IEEE Transactions on, vol.2, issue.10, pp.2220-2226, 2005.

T. Hamamoto, Y. Minami, T. Shino, N. Kusunoki, and H. Nakajima, A Floating-Body Cell Fully Compatible With 90-nm CMOS Technology Node for a 128-Mb SOI DRAM and Its Scalability, IEEE Transactions on Electron Devices, vol.54, issue.3, pp.563-571, 2007.
DOI : 10.1109/TED.2006.890597

T. Hamamoto and T. Ohsawa, Overview and future challenges of floating body RAM (FBRAM) technology for 32nm technology node and beyond, Solid-State Electronics, vol.53, issue.7, pp.676-683, 2009.
DOI : 10.1016/j.sse.2009.03.010

S. Okhonin, P. Fazan, and M. Jones, Zero capacitor embedded memory technology for system on chip, 2005 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'05), pp.xxi-xxv, 2005.
DOI : 10.1109/MTDT.2005.4655409

E. Yoshida and T. Tanaka, ?A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory?, Electron Devices, IEEE Transactions on, vol.3, issue.4, pp.692-697, 2006.

U. E. Avci, I. Ban, D. L. Kencke, and P. L. Chang, ?Floating body cell (FBC) memory for 16-nm technology with low variation on thin silicon and 10-nm BOX?, SOI Conference, IEEE International, pp.29-30, 2008.

M. Bawedin, S. Cristoloveanu, and D. Flandre, ?A capacitorless 1T-DRAM on SOI based on dynamic coupling and double-gate operation?, Electron Device Letters, pp.79-798, 2008.

M. Bawedin, S. Cristoloveanu, Y. G. Yun, and D. Flandre, ?A new memory effect (MSD) in fully depleted SOI MOSFETs?, Solid-State Electonics, pp.1547-1555, 2005.

M. Bawedin, S. Cristoloveanu, D. Flandre, C. Renaux, and A. Crahay, ?Double-gate floating-body memory device?, 2008.

A. Hubert, M. Bawedin, G. Guegan, S. Cristoloveanu, and T. Ernst, ?Experimental comparision of programming mechanisms in 1T-DRAM cells with variable channel length?, Solid-State Device Research Conference, Proceedings of the European, pp.150-153, 2010.

H. Jeong, K. Song, I. H. Park, T. Kim, and Y. S. Lee, ?A new capacitorless 1T DRAM cell: Surrounding gate MOSFET with vertical channel (SGVC cell)A new capacitorless 1T DRAM cell: Surrounding gate MOSFET with vertical channel (SGVC cell)?, Nanotechnology, IEEE Transactions on. ?ol. ?, issue.3, pp.3-5, 2007.

H. K. Chung, H. Jeong, Y. S. Lee, J. Y. Song, and J. P. Kim, A capacitor-less 1T-DRAM cell with vertical surrounding gates using gate-induced drain-leakage (GIDL) current, 2008 IEEE Silicon Nanoelectronics Workshop, pp.1-2, 2008.
DOI : 10.1109/SNW.2008.5418470

N. Rodriguez, F. Gamiz, and S. Cristoloveanu, ?A-RAM memory cell: concept and operation?, Electron Device Letters, pp.972-974, 2010.

N. Rodriguez, C. Navarro, F. Gamize, F. Andrieu, and O. Faynot, ?Experimental demonstration of capacitorless A2RAM cells on silicon-on-insulator? Electron Device Letters, pp.1717-1719, 2012.

M. G. Ertosun, P. Kapur, and K. C. Saraswat, ?A highly scalable capacitorless double gate quantum well single transistor DRAM: 1T-QW DRAM?, Electron Device Letters, IEEE, vol.29, issue.12, pp.140-1407, 2008.

M. H. Cho, C. Shin, and T. J. Liu, ?Convex channel design for improved capacitorless DRAM retention time?, Simulation of semiconductor processes and devices, International Conference on, pp.1-4, 2009.

T. Poren, H. Ru, and ?. , Dake, ?Performance improvement of capacitorless dynamic random access memory cell with band-gap engineered source and drain?, Jpn. J. Appl. Phys, vol.49, 2010.

Y. Choi, J. Han, S. Kim, D. Kim, and M. Jang, ?High speed flash memory and 1T-DRAM on dopant segregated Schottky barrier (DSSB) FinFET SONOS device for multi-functional SoC applications?, Electron Device Meeting, IEEE International, pp.1-4, 2008.

S. Eminente, S. Cristoloveanu, R. Clerc, A. Ohata, and G. Ghibaudo, Ultra-thin fully-depleted SOI MOSFETs: Special charge properties and coupling effects, Solid-State Electronics, vol.51, issue.2, pp.239-244, 2007.
DOI : 10.1016/j.sse.2007.01.016

URL : https://hal.archives-ouvertes.fr/hal-00146784

K. Park, M. Bawedin, J. Lee, Y. Bae, and K. Na, Fully depleted double-gate MSDRAM cell with additional nonvolatile functionality, Solid-State Electronics, vol.67, issue.1, pp.17-22, 2012.
DOI : 10.1016/j.sse.2011.07.013

K. Park, C. M. Park, S. H. Kong, and J. Lee, Novel Double-Gate 1T-DRAM Cell Using Nonvolatile Memory Functionality for High-Performance and Highly Scalable Embedded DRAMs, IEEE Transactions on Electron Devices, vol.57, issue.3, pp.614-619, 2010.
DOI : 10.1109/TED.2009.2038650

J. Han, S. Choi, D. Kim, D. Moon, and Y. Choi, ?Gate-to-source/drain nonoverlap device for soft-program immune unified RAM (URAM)?, Electron Device Letters, pp.44-546, 2009.

S. Choi, C. Kim, S. Kim, and Y. Choi, ?Improvement of the sensing window on a capacitorless 1T- DRAM of a finFET-based unified RAM?, Electron Devices, IEEE Transactions on S. Cristoloveanu. ?Hysteresis Effects in FinFETs with ONO Buried Insulator? ECS Transaction, vol.??, issue.12, pp.3228-3231, 2009.

S. Chang, M. Bawedin, W. Xiong, S. C. Jeon, J. Lee et al., A FinFET memory with remote carrier trapping in ONO buried insulator, Microelectronic Engineering, vol.88, issue.7, pp.1203-1206, 2011.
DOI : 10.1016/j.mee.2011.03.034

S. Chang, M. Bawedin, W. Xiong, J. Lee, J. Lee et al., ?FinFlash with buried storage ONO layer for flash memory application?, Solid-State Electronics, pp.59-66, 2012.

S. Chang, M. Bawedin, W. Xiong, J. Lee, J. Lee et al., ?Remote carrier trapping in FinFETs with ONO buried layer: Temperature effects?, Microelectronics Reliability, pp.38-393, 2013.

S. Chang, M. Cheralathan, M. Bawedin, B. Iniguez, B. Bayraktaroglu et al., Sorin Cristoloveanu, ?Mobility Behavior and Models for Fully Depleted Nanocrystalline ZnO Thin Film Transistors? will be published in Solid-State Electronics

S. Chang, M. Bawedin, W. Xiong, J. Lee, J. Lee et al., Multi-Bit Unified Memory Concept in FinFETs with ONO Buried Insulator, ECS Transactions, vol.54, issue.1, pp.321-328, 2013.
DOI : 10.1149/05401.0321ecst

. Cristoloveanu, ?Investigation of Hysteresis Memory Effects in SOI FinFETs with ONO Buried Insulator?, IEEE SOI Conference, 2010.

S. Chang, M. Bawedin, W. Xiong, J. Lee, and S. Cristoloveanu, ?Scaling of SOI FinFlash Memory with Buried Storage ONO Layer?, 2011.

S. Chang, M. Bawedin, W. Xiong, J. Lee, and S. Cristoloveanu, ?Analysis of Hysteresis Effects in FinFETs with ONO Buried Insulator?, 2011.

S. Chang, M. Cheralathan, M. Bawedin, B. Iniquez, B. Bayraktaroglu et al., ?Mobility Model for SOI-like Nanocrystalline Zinc Oxide Thin-Film Transistor?, EuroSOI 2012 Conference, 2012.